A Self-Contained Cold Plate Utilizing Force-Fed Evaporation for Cooling of High-Flux Electronics
by Thomas Buchanan Baummer
In recent years, the rapid increase in the functionality, speed, and power density of electronics has introduced new challenges, which have led to demand for high heat flux electronics cooling at levels that cannot be met by conventional technologies. The next generation of high power electronics will require advanced cooling beyond the methodologies currently available. This thesis describes work done on a novel form of two-phase heat transfer, named "Force-Fed Evaporation," which addresses this need. This process utilizes evaporation of a liquid in a microchannel surface to produce high heat transfer coefficient cooling at very high heat flux while maintaining a low hydraulic pressure drop. Component level tests were conducted to demonstrate the capability of this process. This led to the development of a self-contained, two-phase cold plate suitable for cooling a high power circuit board. The results show that this technology bears promise for the future of electronics cooling.
http://hdl.handle.net/1903/7795
Investigation of Refrigerant Distribution in a Household Refrigerator with a Focus on the Role of the Accumulator
by Cara Sanderson Martin
In order to maximize household refrigerator performance, it is important to understand the basic relationship between each component as well as the relationship between refrigerant and lubricant used in the system.
This study examines the particular role of the accumulator in a household refrigeration system as well as the oil and refrigerant distribution within the compressor and accumulator. Data and video images were collected to understand the fluid motion throughout the system, particularly in the compressor shell, accumulator, accumulator outlet, and suction and discharge lines. General trends and relationships between the oil and refrigerant were established and the beneficial use of the accumulator for compressor protection was verified.
http://hdl.handle.net/1903/7775
An Innovative Thermal Management Solution for Cooling of Chips with Various Heights and Power Densities
by Timothy Walter McMillin
The challenges and benefits of using a liquid-cooled cold plate to cool a multi-processor circuit board with complex geometry were explored. Two cold plates were designed, fabricated, and tested experimentally. Thermal interface resistance was experimentally discovered and confirmed with numerical simulations.
A circuit board simulator was constructed. This simulator was meant to mimic a multi-processor circuit board with heat sources of different surface areas, heights, and heat dissipations. Results and discussions are presented in this thesis.
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