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UMD faculty publish new book chapter in Cooling of Microelectronic and Nanoelectronic Equipment 

UMD faculty publish new book chapter in Cooling of Microelectronic and Nanoelectronic Equipment 


CEEE Prof. Michael Ohadi, fellow University of Maryland faculty Prof. Michael Pecht and Dr. Jun Dai, have recently published a chapter titled, "Energy Efficiency and Reliability Risk Mitigation of Data Centers through Prognostics and Health Management," in the book  Cooling of Microelectronic and Nanoelectronic Equipment  (WSPC Series in Advanced Integration & Packaging, Vol. 3).

Topics covered in the chapter include the implementation of free air cooling, potential reliability risks associated with free air cooling, risk assessment and mitigation by prognostics and health management (PHM), PHM approaches, and a prognostics-based approach to assess the risks in data centers.

The chapter demonstrates that prognostics-based methods provide a way to assess the health of equipment exposed to free air cooling conditions. The information provided in this chapter can help to facilitate a pro-active decision-making process for the reliable and energy-efficient operation of data centers. You can find the book on Amazon.

October 9, 2014


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